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Naps Careers

Naps Careers
Jornada completa
Presencial

Descripción

As a leading technology innovator, we push the boundaries of what's possible and drive transformation in communication and data processing to help create a smarter, connected future for all. In this journey, we are evolving into an “AI-first” intelligent-edge powerhouse, combining high-performance, low-power compute and seamless connectivity while pushing intelligence closer to users through ultra-efficient, on-device AI that ensures privacy, personalization, and real-time responsiveness. This is the Invention Age—and this is where you come in.

 

Job Overview and Responsibility

We are seeking a highly skilled engineer to develop 2.5D/ 3D chiplet and networking solution based technology-systems co-optimized for a unique era of heterogeneous compute as Moore’s law slows down. He/she should be able to apply that knowledge to define Qualcomm’s next generation SoC and platform architectures including partitions for logic and memories and involving 2.5D/3D chiplets and networking technologies to connect them.

Candidate will also drive innovation in the group to effectively map emerging AI and other compute use cases to process and chip-integration solutions with detailed knowledge of process technology, 2.5D/ 3D chiplet architecture, networking technologies and trade-offs. Knowledge of different Ips e.g. CPU, GPU, NPU and how they act together to drive an E2E use case is a plus. Candidate will work with internal architecture and system teams to develop 2.5D/3D partitions and map to 3D stacking topologies. Candidate will perform system KPI analysis to drive 3D architecture and stacking strategies for new product introduction.

 

Minimum Qualifications:

  • Excellent understanding of generic and AI use case KPI dependency on process and system architecture involving chiplets and networking technologies.
  • Good knowledge of heterogeneous architecture, 2.5D/ 3D integration schemes.
  • Basic programming skills e.g. ability to model e.g. in Python or other languages system use case impact of 3D architectures, integration schemes.
  • Master's in Electrical Engineering, Computer Science, or a related field

 

Additional Qualifications:

  • Ability to work without much supervision and as part of a team
  • Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach
  • Advanced data analysis and interpretation skills are required.

 

Minimum Qualifications

• Bachelor's degree in Science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience. .
OR
Master's degree in Science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience.
OR
PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience.

 

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